CGM Sensor

Manufacturing & Assembly Flow

Stream A — Si foundry
+ FO-WLP

Commercial Si foundry

Chiplet set tapeout
AFE · PMU · RF · MCU

SkyWater — FO-WLP

Fan-out wafer-level
packaging
ACF-ready pads

Stream B1 — μ-fluidic
pouches

Dartmouth WeFab

μ-fluidic pouch
fabrication

Gamma irradiation
sterilization

Stream B2 — PI
filament/chassis

Dartmouth WeFab

PI filament / chassis fab
Thin-film GFET · RE · CE · μ-fluidic ch · extended pads

Pad zones plasma-cleaned

Ready for ACF assembly

Stream C — passives

Commercial vendors

Battery · resistors · capacitors
Antenna

ACF Bond 1 — Chiplet module (M2) onto PI chassis

ACF Bond 2 — μ-pouch module (M3) onto PI chassis

Attach battery, passives, antenna

Full assembly electrical check (pre-encapsulation)

Parylene-C CVD — full hermetic encapsulation

ICP-RIE — selective Parylene opening

Plasma etch opens GFET sensor windows + RE/CE electrode sites

Sequential aptamer functionalization + sensor QC

Insertion needle preload

EtO sterilization

Complete sterile Delphi sensor · Cold-chain 2–8°C ·
Ready for clinical trials under IRB NSR studies

Commercial scale-up (tech transfer) and productization

Thin-film PI fab · inline dual ACF bonding · automated Parylene CVD +
ICP-RIE · high-throughput aptamer functionalization